Laird acquired Nextreme in February 2013. Nextreme Thermal Solutions, Inc. (“Nextreme”), was a US based developer of thin-film thermoelectric technologies. Nextreme’s micro-scale form factors, high power-pumping capabilities and a high-volume semiconductor manufacturing process enabled low-cost, high-performance thermal management and energy harvesting solutions. Thin-film peltiers are still an emerging technology that is suited to high volume applications requiring hundreds of thousands of pieces per year
The eTEC Series is a thin film thermoelectric module (TEM) with high heat flux density. Due to its size input power requirements and power generation capacity this device is suited for use in applications to stabilize the temperature of sensitive optical components in telecom and photonics industries.
The eTEC™ Series of TEMs enable high powered optoelectronics to maintain peak performance by stabilizing the temperature of the device during operation. The modules are assembled using thin film technology that enables the TEMs to have ten times the heat pumping density per unit area than conventional bulk thermoelectric technology. The ceramic substrates are gold metallized to allow the product to be embedded into densely packed optoelectronics.
“As next generation packaging shrinks in size, conventional bulk technology becomes more of a design constraint due to its large package size,” said Andrew Dereka, Laird Technologies Product Manager. “Thin film technology provides our customers with more flexibility to optimize package design and keep optics stable in temperature fluctuating environments.”
The thin film eTEC TEMs have heat pumping densities ranging from 75 to 90 W/cm2 at an ambient temperature of 25°C. The new models include:
HV14-18-F0-0101-GG – 1.4 Watts in 1 mm2
HV37-48-F2-0202-GG – 3.7 Watts in 6.9 mm2
HV56-72-F2-0203-GG – 4.8 Watts in 10.2 mm2
Constructed with Bismuth Telluride thin film technology and thermally conductive Aluminum Nitride ceramics, the eTEC™ Series is designed for higher voltage and lower, sub 10 Watt heat pumping applications. Other features include RoHS compliance, pending Telcordia Compliance and gold metallization for solder ability to mating substrate surfaces.
Min order quantities apply to this product – please enquire.